Wet chemistry processes are an important part of semiconductor device fabrication. Use of chemical solutions is often needed at a various stages of device production; most commonly during substrate clean and wet etching. For silicon (Si) based devices, many of the wet chemical processes are already well-defined (i.e. required solution concentration, etch rate, etc.) in technical literature. However, when working with new materials, development of wet chemical processes that are controllable and selective in their action is a critical part of device fabrication and research.

IITBNF provides a safe and well-equipped environment to develop and carry out all wet chemical processes necessary for device fabrication. In order to minimize cross-contamination and maintain process control, we have dedicated wet benches and clean stations for silicon placed away from general purpose stations. Complementary apparatus such as sonicators, spin coaters and hot plates are also provided at specific stations.

The following table lists the key wet chemistry equipment within IITBNF:

InstrumentLocationContamination category
1 2 inch RCA Clean Station 6clean (for si)
2 TMAH wet etch station 6gold contaminated
3 General Purpose Wet Bench (Wet Chemistry Lab) 6gold contaminated
4 4 inch RCA Clean Station 6clean (for si)
5 General Purpose Wet Bench (EC Lab) 10gold contaminated
6 Piranha Cleaning 6clean (for si)
7 Wet bench_2” RCA , Piranha 29clean
8 Wet bench_Metal etching 29gold contaminated
9 Wet bench_Solvents 29gold contaminated
10 Schlenk Line (1)_Fume Hood 1 8gold contaminated
11 4-arm glove box_7.1 lab 8gold contaminated
12 2-arm Glove Box 31gold contaminated
13 Nano Wet Bench 19clean
14 1.2 Lab wet bench 21clean
  • To understand what the contamination categories mean, click here

  • To check if your process plan complies with contamination rules, click here

  • To view current working status of all the instruments, click here