Equipment Details

Flip Chip Bonder

Name of the EquipmentFlip Chip Bonder
Categorygold contaminated
OperatorKulasekaran Muniappan
System OwnerKulasekaran Muniappan

Short Name
Make/ Model/
Critical ToolNo
Serial Number
Equipment TypeMiscellaneous
LocationMBE Clean Room 2 (NanoE bldg, Gr floor)
AMC Required
Local Dealer

Actual Dealer

SOP SOP/117_SOP.pdf
Training & other policy documentsPOLICY/117_POLICY.pdf
Glimpse GLIMPSE/117_Glimpse.pdf
Tool Facilities Requirements
Lab Phone No4488 Ext Flash 109
Substrate allowedGaAs, Si, Quartz
Substrate Dimension1x1cm
Chemical allowed, In, Al, Gold
Precursors/ Targets allowed
*Based on stock availability
Precursor/ Target loaded inside tool
Target dimension
Gases allowed
Contamination remarks
Last updated on: 20-Jan-2023