Flip Chip Bonder
| Name of the Equipment | Flip Chip Bonder |
| Category | gold contaminated |
| Operator | Kulasekaran Muniappan |
| System Owner | Kulasekaran Muniappan kulasekaran.m@iitb.ac.in |
| Short Name | |
| Make/ Model | / |
| Critical Tool | No |
| Serial Number | |
| FootPrint | |
| InstallationDate | |
| Equipment Type | Miscellaneous |
| Location | MBE Clean Room 2 (NanoE bldg, Gr floor) |
| AMC | Required |
| Local Dealer | |
| Actual Dealer | |
| SOP | SOP/117_SOP.pdf |
| Training & other policy documents | POLICY/117_POLICY.pdf |
| Recipies | |
| Glimpse | GLIMPSE/117_Glimpse.pdf |
| Tool Facilities Requirements | |
| Access | Controlled |
| Lab Phone No | 4488 Ext Flash 109 |
| Substrate allowed | GaAs, Si, Quartz |
| Substrate Dimension | 1x1cm |
| Chemical allowed | , In, Al, Gold |
| Precursors/ Targets allowed *Based on stock availability | |
| Precursor/ Target loaded inside tool | |
| Target dimension | |
| Gases allowed | |
| Contamination remarks |