Wire Bonder_Hybond
| Name of the Equipment | Wire Bonder_Hybond |
| Category | gold contaminated |
| Operator | |
| System Owner | Kulasekaran Muniappan kulasekaran.m@iitb.ac.in |
| Short Name | |
| Make/ Model | Hybond Inc/ 626 Multipurpose Dig |
| Critical Tool | No |
| Serial Number | 2135 |
| FootPrint | |
| InstallationDate | 04/12/2006 |
| Equipment Type | Miscellaneous |
| Location | Applied Quantum Mechanics Lab 3(NanoE bldg, 5th floor) |
| AMC | Required |
| Local Dealer | El Camino Technologies Pvt. Ltd. #8, 1st block, 1st main, BEL Layout, Vidyaranyapura, Bangalore - 560 097, INDIA. Tel: 91 80 23640503 Fax: 91 80 23641170 |
| Actual Dealer | Hybond, Inc 330 State Place Escondido, California,92029, USA Tel:1-760-746-7105 Fax:1-760-746-1408 |
| SOP | |
| Training & other policy documents | |
| Recipies | |
| Glimpse | GLIMPSE/128_Glimpse.pdf |
| Tool Facilities Requirements | Vacuum Pump |
| Access | Open |
| Lab Phone No | 4419 |
| Substrate allowed | Si/ III-V |
| Substrate Dimension | Pieces to 4 inch |
| Chemical allowed | N/A, Ti/ Al/ Ni/ Pt/ Au/ Cr etc |
| Precursors/ Targets allowed *Based on stock availability | N/A |
| Precursor/ Target loaded inside tool | |
| Target dimension | N/A |
| Gases allowed | N/A |
| Contamination remarks | N/A |