Logitech WSB2 Wafer Substrate Bonding Unit
| Name of the Equipment | Logitech WSB2 Wafer Substrate Bonding Unit |
| Category | gold contaminated |
| Operator | |
| System Owner | Kulasekaran Muniappan kulasekaran.m@iitb.ac.in |
| Short Name | |
| Make/ Model | Logitech/ |
| Critical Tool | No |
| Serial Number | |
| FootPrint | 3 feet by 3 feet |
| InstallationDate | 04/03/2011 |
| Equipment Type | Miscellaneous |
| Location | EC Lab |
| AMC | Not Required |
| Local Dealer | Lawrence & Mayo 11 Government Place East Kolkata West Bengal 700 069 India |
| Actual Dealer | Mr Suman Kundu 11 Government Place East Kolkata West Bengal 700 069 India |
| SOP | SOP/160_SOP.pdf |
| Training & other policy documents | POLICY/160_POLICY.pdf |
| Recipies | |
| Glimpse | GLIMPSE/160_Glimpse.pdf |
| Tool Facilities Requirements | Vacuum pump, chiller, compressor |
| Access | Open |
| Lab Phone No | No Number |
| Substrate allowed | III-V materials |
| Substrate Dimension | 1cm X 1cm |
| Chemical allowed | N/A, III-V materials |
| Precursors/ Targets allowed *Based on stock availability | N/A |
| Precursor/ Target loaded inside tool | |
| Target dimension | N/A |
| Gases allowed | N/A |
| Contamination remarks |