Equipment Details

Electroplating system - Au/Ni/Cu

Name of the EquipmentElectroplating system - Au/Ni/Cu
Categorygold contaminated
OperatorMinita Surwade (NH)
Pankajkumar Gound
System OwnerMinita Surwade (NH)

Short Name
Make/ ModelAssembled/
Critical ToolNo
Serial Number
Equipment TypeDeposition, Growth and Annealing systems
LocationEC Lab
AMC Not Required
Local Dealer

Actual Dealer

SOP SOP/202_SOP.rar
Training & other policy documents
Recipies RECEPIES/202_RECEPIES.pdf
Glimpse GLIMPSE/202_GLIMPSE.pdf
Tool Facilities Requirements
Lab Phone NoNo Number
Substrate allowed
Substrate Dimension
Chemical allowed,
Precursors/ Targets allowed
*Based on stock availability
Precursor/ Target loaded inside tool
Target dimension
Gases allowed
Contamination remarksOutside samples need approval. For Ni electroplating: Ni electroplating solution is having Na & K elements,so sample processed in this should not enter into other IITBNF lab tools.
Last updated on: 20-Jan-2023