Electroplating system - Au/Ni/Cu
| Name of the Equipment | Electroplating system - Au/Ni/Cu |
| Category | gold contaminated |
| Operator | Minita Surwade (NH) Pankajkumar Gound |
| System Owner | Minita Surwade (NH) minita@iitb.ac.in |
| Short Name | |
| Make/ Model | Assembled/ |
| Critical Tool | No |
| Serial Number | |
| FootPrint | |
| InstallationDate | |
| Equipment Type | Deposition, Growth and Annealing systems |
| Location | EC Lab |
| AMC | Not Required |
| Local Dealer | |
| Actual Dealer | |
| SOP | SOP/202_SOP.rar |
| Training & other policy documents | |
| Recipies | RECEPIES/202_RECEPIES.pdf |
| Glimpse | GLIMPSE/202_GLIMPSE.pdf |
| Tool Facilities Requirements | |
| Access | Open |
| Lab Phone No | No Number |
| Substrate allowed | |
| Substrate Dimension | |
| Chemical allowed | , |
| Precursors/ Targets allowed *Based on stock availability | |
| Precursor/ Target loaded inside tool | |
| Target dimension | |
| Gases allowed | |
| Contamination remarks | Outside samples need approval. For Ni electroplating: Ni electroplating solution is having Na & K elements,so sample processed in this should not enter into other IITBNF lab tools. |