Equipment Details


Wire Bonder (TPT HB16)_Aluminium

Name of the EquipmentWire Bonder (TPT HB16)_Aluminium
Categoryoff line a
OperatorMinita Surwade (NH)
System OwnerAnjum Ahmed (NH)
anjum04@iitb.ac.in

Pankajkumar Gound
p15129@iitb.ac.in

Short Name
Make/ ModelTPT
Critical Tool
Serial Number
FootPrint
InstallationDate
Equipment TypeMiscellaneous
LocationMCL Lab
AMC Required
Local Dealer

Actual Dealer

SOP
Training & other policy documents
Recipies
Glimpse
Tool Facilities Requirements
AccessControlled
Lab Phone No6922
Substrate allowed
Substrate Dimension
Chemical allowedIPA, Acetone for cleaning,
Precursors/ Targets allowed
*Based on stock availability
NA
Precursor/ Target loaded inside tool
Target dimensionNA
Gases allowedNA
Contamination remarksThe bonding samples/pads should be clean without dust particles.
Last updated on: 20-Jul-2022