Wire bonder (TPT HB05)_Gold
| Name of the Equipment | Wire bonder (TPT HB05)_Gold |
| Category | gold contaminated |
| Operator | Pankajkumar Gound |
| System Owner | Pankajkumar Gound p15129@iitb.ac.in Srilagna Sahoo (H) 194076013@iitb.ac.in |
| Short Name | |
| Make/ Model | TPT HB05 |
| Critical Tool | No |
| Serial Number | |
| FootPrint | |
| InstallationDate | 2019 |
| Equipment Type | Miscellaneous |
| Location | 2D Materials and Devices Lab |
| AMC | Not Required |
| Local Dealer | |
| Actual Dealer | |
| SOP | SOP/347_SOP.pdf |
| Training & other policy documents | POLICY/347_POLICY.pdf |
| Recipies | |
| Glimpse | GLIMPSE/347_GLIMPSE.pdf |
| Tool Facilities Requirements | |
| Access | Controlled |
| Lab Phone No | 4456 |
| Substrate allowed | Si/Metal |
| Substrate Dimension | NA |
| Chemical allowed | NA, Gold wire bonds |
| Precursors/ Targets allowed *Based on stock availability | NA |
| Precursor/ Target loaded inside tool | |
| Target dimension | NA |
| Gases allowed | NA |
| Contamination remarks | NA |