Equipment Details


Wire bonder (TPT HB05)_Gold

Name of the EquipmentWire bonder (TPT HB05)_Gold
Categorygold contaminated
OperatorPankajkumar Gound
System OwnerPankajkumar Gound
p15129@iitb.ac.in

Srilagna Sahoo (H)
194076013@iitb.ac.in

Short Name
Make/ ModelTPT HB05
Critical ToolNo
Serial Number
FootPrint
InstallationDate2019
Equipment TypeMiscellaneous
Location2D Materials and Devices Lab
AMC Not Required
Local Dealer

Actual Dealer

SOP SOP/347_SOP.pdf
Training & other policy documentsPOLICY/347_POLICY.pdf
Recipies
Glimpse GLIMPSE/347_GLIMPSE.pdf
Tool Facilities Requirements
AccessControlled
Lab Phone No4456
Substrate allowedSi/Metal
Substrate DimensionNA
Chemical allowedNA, Gold wire bonds
Precursors/ Targets allowed
*Based on stock availability
NA
Precursor/ Target loaded inside tool
Target dimensionNA
Gases allowedNA
Contamination remarksNA
Last updated on: 20-Jul-2022