Equipment Details

Wafer bonder

Name of the EquipmentWafer bonder
Categorygold contaminated
System OwnerGaurav Garg NH

Short Name
Make/ ModelEV Group/ EVG520
Critical ToolNo
Serial NumberNA
FootPrint1.22 mtrs X 0.75 mtrs
Equipment TypeMiscellaneous
LocationSpectroscopy Lab
AMC Required
Local DealerM/s Norinco Pvt. Ltd.

M/s Norinco Pvt. Ltd., Nowroji Mansion, 6th floor, 31, Nathelal Parikh Marg, Mumbai400039 Tel-022-22842042/22841368 Email:,
Actual DealerM/s E.V. Group

M/s E.V. Group, E. Thallner GmbH, DI Erich Thallner StraBe 1A-4780 Scharding, Austria Email: Phone: 43 7712 5311 0
SOP SOP/97_SOP.pdf
Training & other policy documentsPOLICY/97_POLICY.pdf
Glimpse GLIMPSE/97_Glimpse.pdf
Tool Facilities RequirementsWater connection, Nitrogen
Lab Phone No4411
Substrate allowedSi, Glass
Substrate DimensionMax- 5 inch wafer, Min- 2 inch wafer
Chemical allowedIPA for cleaning, SiO2, SiNx, a-Si
Precursors/ Targets allowed
*Based on stock availability
Precursor/ Target loaded inside tool
Target dimensionNA
Gases allowedNA
Contamination remarksIt is gold contaminated chamber. Na+ & K+ containing samples are strictly not allowed. For outside/ NCPRE/ Org electronics lab samples, contact SO/Process engineer.
Last updated on: 20-Jan-2023