Equipment Details


Logitech WSB2 Wafer Substrate Bonding Unit

Name of the EquipmentLogitech WSB2 Wafer Substrate Bonding Unit
Categorygold contaminated
Operator
System Owner
Short Name
Make/ ModelLogitech/
Critical ToolNo
Serial Number
FootPrint3 feet by 3 feet
InstallationDate04/03/2011
Equipment TypeMiscellaneous
LocationEC Lab
AMC Not Required
Local DealerLawrence & Mayo

11 Government Place East Kolkata West Bengal 700 069 India
Actual DealerMr Suman Kundu

11 Government Place East Kolkata West Bengal 700 069 India
Training & other policy documentsPOLICY/160_POLICY.pdf
Recipe List
Glimpse GLIMPSE/160_Glimpse.pdf
Tool Facilities RequirementsVacuum pump, chiller, compressor
AccessOpen
Lab Phone No
Substrate allowedIII-V materials
Substrate Dimension1cm X 1cm
Chemical allowedN/A, III-V materials
Precursors/ Targets allowed
*Based on stock availability
N/A
Precursor/ Target loaded inside tool
Target dimensionN/A
Gases allowedN/A
Contamination remarks
Last updated on: 24-Oct-2026