| Name of the Equipment | Wire Bonder (TPT HB16)_Aluminium |
| Category | off line a |
| Operator | Gopika Suresh
Minita Surwade
|
| System Owner | Anjum Khan
anjum04@iitb.ac.in
Pankajkumar Gound
p15129@iitb.ac.in
|
| Short Name | |
| Make/ Model | TPT |
| Critical Tool | No |
| Serial Number | |
| FootPrint | |
| InstallationDate | |
| Equipment Type | Miscellaneous |
| Location | MCL Lab |
| AMC | Required |
| Local Dealer |
|
| Actual Dealer |
|
| Training & other policy documents | |
| Recipe List | |
| Glimpse | |
| Tool Facilities Requirements | |
| Access | Controlled |
| Lab Phone No | |
| Substrate allowed | |
| Substrate Dimension | |
| Chemical allowed | IPA, Acetone for cleaning, |
Precursors/ Targets allowed
*Based on stock availability | NA |
| Precursor/ Target loaded inside tool | 63 |
| Target dimension | NA |
| Gases allowed | NA |
| Contamination remarks | The bonding samples/pads should be clean without dust particles. |
