Plasma Doping System
| Name of the Equipment | Plasma Doping System |
| Category | semi clean b |
| Operator | Shilpa Kharat |
| System Owner | Shilpa Kharat 30003402@iitb.ac.in |
| Short Name | |
| Make/ Model | Ultech |
| Critical Tool | Yes |
| Serial Number | Impulse 100Series |
| FootPrint | |
| InstallationDate | 14/8/2109 |
| Equipment Type | Deposition, Growth and Annealing systems |
| Location | Nanoelectronics Processing Lab (NanoE bldg, 1st floor) |
| AMC | Required |
| Local Dealer | Tesscorn Nano Science Inc. Tesscorn Nano Science Inc. 1285, 5 th Main, 17 th Cross, HSR Sector 7, Bangalore 560102. Landline: +91.80.2572.9425 |
| Actual Dealer | ULTECH Co. Ltd ULTECH Co.,Ltd. South Korea |
| Training & other policy documents | POLICY/343_POLICY.pdf |
| Recipe List | |
| Glimpse | GLIMPSE/343_GLIMPSE.PDF |
| Tool Facilities Requirements | |
| Access | Open |
| Lab Phone No | Implant |
| Substrate allowed | Si, Ge, C, Sn |
| Substrate Dimension | Max 4 inch |
| Chemical allowed | -, only Group IV (Si, Ge, C, Sn) allowed. |
| Precursors/ Targets allowed *Based on stock availability | NA |
| Precursor/ Target loaded inside tool | |
| Target dimension | NA |
| Gases allowed | PH3, B2H6, Ar, CHF3 , SiH4, O2, N2 |
| Contamination remarks | only Group IV (Si, Ge, C, Sn) allowed. |