Plasma asher
| Name of the Equipment | Plasma asher |
| Category | gold contaminated |
| Operator | Shilpa Kharat Minita Surwade |
| System Owner | Shilpa Kharat 30003402@iitb.ac.in |
| Short Name | |
| Make/ Model | Fabricated in CEN/ NA |
| Critical Tool | Yes |
| Serial Number | NA |
| FootPrint | width=0.69m, Depth 1.2m, Height 1.56m |
| InstallationDate | 2007 |
| Equipment Type | Dry Etch tools |
| Location | Nanoelectronics Processing Lab (NanoE bldg, 1st floor) |
| AMC | Required |
| Local Dealer | NA NA |
| Actual Dealer | NA NA |
| Training & other policy documents | |
| Recipe List | RECEPIES/87_RECEPIES.pdf |
| Glimpse | GLIMPSE/87_GLIMPSE.pdf |
| Tool Facilities Requirements | Water connection, Oxygen, CHF3 |
| Access | Open |
| Lab Phone No | Plasma Asher and Etcher |
| Substrate allowed | Quartz, Si |
| Substrate Dimension | maximun size 2 inch |
| Chemical allowed | NA, ppr, su8, cblack, PDMS, PMMA, metals, oxides, Polymer(VDF-TrFe0/ BaTiO3 |
| Precursors/ Targets allowed *Based on stock availability | NA |
| Precursor/ Target loaded inside tool | |
| Target dimension | NA |
| Gases allowed | Oxygen, CF4, CHF3 |
| Contamination remarks | Powdered material not allowed. And Na+ and K+ are not allowed. For outside/ NCPRE/ Org electronics lab samples, contact SO/ Process engineer. |