STSRIE
| Name of the Equipment | STSRIE |
| Category | semi clean a |
| Operator | Shilpa Kharat Pankajkumar Gound |
| System Owner | Pankajkumar Gound p15129@iitb.ac.in Shilpa Kharat 30003402@iitb.ac.in |
| Short Name | |
| Make/ Model | STS/ 320 PC |
| Critical Tool | No |
| Serial Number | |
| FootPrint | |
| InstallationDate | |
| Equipment Type | Dry Etch tools |
| Location | Micro2 Lab |
| AMC | Required |
| Local Dealer | |
| Actual Dealer | M/s. CTP Company Services. M/s. CTP Company Services., 3 Commercial Road, Cwmfelinfach, Near Newport, Gwent, NP11-7HW, U.K. Mob: 7754002875 Email: gareth.morgan@homecall.co.uk |
| Training & other policy documents | POLICY/93_POLICY.pdf |
| Recipe List | RECEPIES/93_RECEPIES.pdf |
| Glimpse | GLIMPSE/93_GLIMPSE.pdf |
| Tool Facilities Requirements | chiller, Nitrogen gas(GN2, PN2) and process gases CF4, SF6, CHF3, O2 |
| Access | Open |
| Lab Phone No | Reactive Ion Etching |
| Substrate allowed | Si, Ge, GeSn, Diamond |
| Substrate Dimension | Pieces to 6 inch wafer |
| Chemical allowed | NA, SiO2, Si, Ge, Photoresists, HfO2, Al2O3, TiO2, NbN, Pt |
| Precursors/ Targets allowed *Based on stock availability | NA |
| Precursor/ Target loaded inside tool | |
| Target dimension | NA |
| Gases allowed | SF6, CF4, CHF3, O2, N2 |
| Contamination remarks | Only Pt is allowed for inside the chamber as hard mask. Metal etching is not allowed. |